Email: ekpum@delsu.edu.ng
- Area of Specialization: Thermal Engineering (Design, Finite Element Modelling, and Materials characterization), and Manufacturing
- Department of Mechanical Engineering
- Engr. Dr Mathias Ekpu, MNSE, MNIMechE, COREN Registered, is currently an Associate Professor in the Department of Mechanical Engineering and also, the Head of Mechanical Engineering Department, Oleh Campus. He received his first degree in Mechanical Engineering from Ambrose Alli University Ekpoma. While his Master’s degree in Mechanical and Manufacturing Engineering and his Doctor of Philosophy degree in Mechanical Engineering were awarded by University of Greenwich London, United Kingdom. Dr Ekpu is research active and has authored and co-authored several journal and conference articles. His area of research includes: Thermal Engineering (this involves design, finite element modelling, and material characterization) and Manufacturing. Dr Ekpu has served in different capacity within the University, Faculty of Engineering, and Department of Mechanical Engineering. He was the former Associate Dean, Faculty of Engineering, Oleh Campus (2020-2022), and was formerly the Head of Department of Mechanical Engineering (2017 - 2019). He has been involved in several committees either as a member or as chairman.
My Publications- Ekpu, M (2019) Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
https://www.ajol.info/index.php/jasem/article/view/192501 Vol.23 Pages: 2059 - 2063
- Ekpu, M (2018) Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
https://www.ajol.info/index.php/jasem/article/view/181395 Vol.22 Pages: 1797 - 1800
- M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba (2014) The effect of thermal constriction on heat management in a microelectronic application, Microelectronics Journal/Elsevier
https://www.sciencedirect.com/science/article/abs/pii/S0026269213002516 Vol.45 Pages: 159 - 166
- M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics, Microelectronics Reliability/Elsevier
https://www.sciencedirect.com/science/article/abs/pii/S002627141300317X Vol.54 Pages: 239 - 244
- KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu (2013) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach, Engineering Failure Analysis/Elsevier
https://www.sciencedirect.com/science/article/abs/pii/S1350630712002166 Vol.28 Pages: 192 - 207
- KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device, Microelectronics Reliability/Elsevier
https://www.sciencedirect.com/science/article/abs/pii/S0026271412000339 Vol.52 Pages: 1409 - 1419
- M Ekpu, R Bhatti, MI Okereke, S Mallik, KC Otiaba (2013) Prediction and optimization of design parameters of microelectronic heat sinks, Journal of Emerging Trends in Engineering and Applied Sciences/Scholarlink Research Institute
https://www.scholarlinkinstitute.org/jeteas/abstractview.php?id=0063 Vol.4 Pages: 493 - 500
- M Ekpu, R Bhatti, MI Okereke, KC Otiaba (2013) Fatigue life analysis of Sn96. 5Ag3. 0Cu0. 5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications, International Symposium on Microelectronics/imapsource.org
https://www.imapsource.org/doi/abs/10.4071/isom-2013-WA23 Vol.2013 Pages: 473 - 477
- M Ekpu, R Bhatti, N Ekere, S Mallik, K Otiaba (2012) Effects of thermal interface materials (solders) on thermal performance of a microelectronic package, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS/IEEE
https://ieeexplore.ieee.org/abstract/document/6235300 Vol. Pages: 154 - 159
- M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package, International Conference on Adaptive Science and Technology/IEEE
https://ieeexplore.ieee.org/abstract/document/6145164 Vol. Pages: 127-132
- M Ekpu, R Bhatti, N Ekere, S Mallik (2011) Advanced thermal management materials for heat sinks used in microelectronics, European Microelectronics & Packaging Conference/IEEE
https://ieeexplore.ieee.org/abstract/document/6142404 Vol. Pages: 1 - 8
- KC Otiaba, RS Bhatti, NN Ekere, S Mallik, EH Amalu, M Ekpu (2011) Thermal effects of die-attach voids location and style on performance of chip level package, International Conference on Adaptive Science and Technology/IEEE
https://ieeexplore.ieee.org/abstract/document/6145176 Vol. Pages: 231 - 236
- KC Otiaba, RS Bhatti, NN Ekere, M Ekpu, J Adeyemi (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device, International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)/IEEE
https://ieeexplore.ieee.org/abstract/document/6081033 Vol. Pages: 1 - 5
- Ekpu, M (2020) Thermo-Mechanical Analysis of Aluminium Silicon Carbide Composite Materials, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
https://www.ajol.info/index.php/jasem/article/view/197666 Vol.24 Pages: 961-966
- Ekpu, M (2020) Optimisation of a Microelectronic Assembly Package using Response Surface Methodology, Nigerian Journal of Technology (NIJOTECH)/Faculty of Engineering, University of Nigeria, Nsukka
https://www.nijotech.com/index.php/nijotech/article/view/2443 Vol.39 Pages: 1058-1065
- Ekpu, M. and Obadina, O.B. (2020) Power Production using Natural Gas in Nigeria: Trends, Challenges and Way Forward, Nigerian Research Journal of Engineering and Environmental Sciences/Faculty of Engineering UNIBEN
http://rjees.com/abstract/power-production-using-natural-gas-in-nigeria-trends-challenges-and-way-forward Vol.5 Pages: 873-885
- Ekpu, M (2020) Effect of Tensile Load on the Mechanical Properties of AlSiC Composite Materials using ANSYS Design Modeller, Nigerian Journal of Technological Development (NJTD)/Faculty of Engineering and Technology, University of Ilorin, Nigeria
https://journal.njtd.com.ng/index.php/njtd/article/view/576 Vol.17 Pages: 301-305
- Ekpu, M (2021) Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics, Soldering & Surface Mount Technology/Emerald Insight
https://www.emerald.com/insight/content/doi/10.1108/SSMT-07-2020-0033/full/html Vol.33 Pages: 249-257
- Ekpu, M (2020) The Effect of Silicon Carbide Particulate Inclusions on Aluminium Metal Matrix Composite Materials, Umudike Journal of Engineering and Technology/Faculty of Engineering and Engineering Technology, Michael Okpara University of Agriculture, Umudike
https://ujetmouau.net/journal_paper.aspx?PID=226 Vol.6 Pages: 26-34
- Ekpu, M (2021) Effect of Elevated Temperatures on SAC305 Solder Alloy Thermal Interface Material in a Microelectronic Assembly, FUOYE Journal of Engineering and Technology/Faculty of Engineering FUOYE
http://engineering.fuoye.edu.ng/journal/index.php/engineer/article/view/590 Vol.6 Pages: 77-81
- Ekpu, M (2021) Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications, Journal of Electronic Materials/Springer Nature
https://link.springer.com/article/10.1007/s11664-021-08968-8 Vol.50 Pages: 4433-4441
- M. Ekpu, E.A. Ogbodo, F. Ngobigha, J.E. Njoku (2022) Thermal effect of cylindrical heat sink on heat management in LED applications, Energies/MDPI
https://www.mdpi.com/1996-1073/15/20/7583 Vol.15 Pages: 7587
- E.O. Ifeanyi, S.C. Ikpeseni, M.C. Ogbue, M. Ekpu, L.C. Edomwonyi-Otu (2023) Preliminary Investigation of African Oil Bean Husk as a Feasible Fluid-Loss Control Agent in Drilling Muds, NIPES Journal of Science and Technology Research /Nigerian Institution of Professional Engineers and Scientists, Abuja
https://journals.nipes.org/index.php/njstr/article/view/221 Vol.5 Pages: 218-229
- Jude E. Njoku, Emeka H. Amalu, Ndy Ekere, Sabuj Mallik, Mathias Ekpu, Eugene A. Ogbodo (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors, Journal of Electronic Materials/Springer Nature
https://link.springer.com/article/10.1007/s11664-023-10340-x Vol.52 Pages: 3786-3796
- M. Ekpu, I.A. Ayomide (2023) Design, Construction and Testing of a Weighing Equipment for Powdered Food Products, Arid zone journal of engineering, technology & environment (AZOJETE)/Faculty of Engineering, University of Maiduguri, Maiduguri, Nigeria.
https://www.azojete.com.ng/index.php/azojete/article/view/755 Vol.19 Pages: 381-390
- Sunday C. Ikpeseni, Henry O. Orugba, Ufuoma J. Efetobor, Samuel O. Sada, Mathias Ekpu, Monday E. Amagre, Hilary I. Owamah (2023) Pyrolysis characteristics and kinetics of the thermal degradation of elephant grass (Pennisetum purpureum): a comparative analysis using the Flynn–Wall–Ozawa and the Kissinger–Akahira–Sunose methods, Environment, Development and Sustainability/Springer Nature
https://link.springer.com/article/10.1007/s10668-023-04322-6 Vol. Pages: In press
- Enaghinor A.L., Ekpu M., Ukrakpor F. (2023) Application of Response Surface Methodology for the Optimization Modeling of Delivery Flexibility for SMES in Nigeria, Journal of the Nigerian Association of Mathematical Physics
https://nampjournals.org.ng/index.php/home/article/view/40 Vol.65 Pages: 117-124
- P.O. Ukachi, M. Ekpu, S.O. Sada, S.C. Ikpeseni (2024) Optimisation of the Performance of Ethanol-Gasoline Fuel Blend for Internal Combustion Engines, Journal of Inventive Engineering and Technology (JIET)/Nigerian Society of Engineers.
https://www.jiengtech.com/index.php/INDEX/article/view/88 Vol.5 Pages: 1-8
- Chinedu S. Odali, Mathias Ekpu, Sunday C. Ikpeseni, Esiri M.O. Amagre, Eguakhide Atikpo, Samuel O. Sada, Judith Umukoro (2024) Corrosion Inhibition Efficiency of Chromolaena odorata Leaves Extract on Mild Steel in Sulphuric Acid Medium, NIPES Journal of Materials Engineering, Structures and Computation /Nigerian Institution of Professional Engineers and Scientists, Abuja
https://journals.nipes.org/index.php/jmsc/article/view/828 Vol.3 Pages: 1-11
- Aboloje, A.E., Sada, S.O., Ekpu, M., Eyenubo, J. (2024) Evaluation of the optimal cutting performance of high-speed steel and tungsten carbide cutting tools in the machining of AISI 304 steel, International Journal of Advanced Manufacturing Technology/Springer Nature
https://link.springer.com/article/10.1007/s00170-023-12909-6 Vol.130 Pages: 3609-3617
- P.O. Ukachi, M. Ekpu, S.C. Ikpeseni, S.O. Sada (2024) Effect of gasoline-ethanol blends on the performance of a four stroke engine using Ricardo Wave software, World Journal of Engineering/Emerald Insight
https://www.emerald.com/insight/content/doi/10.1108/WJE-11-2023-0482/full/html Vol. Pages: 1-9
- M. Ekpu, I.A. Agboola (2024) Effect of lead-free solder thermal interface material thickness on the reliability of electronic components in a random vibration environment., International Journal of Science and Research Archive
https://ijsra.net/content/effect-lead-free-solder-thermal-interface-material-thickness-reliability-electronic Vol.11 Pages: 898-908
- P.E. Emumejaye, S.C. Ikpeseni, M. Ekpu, S.O. Sada, P.O. Ohwofadjeke (2023) Proximate Analysis of Chicken Eggshell Using Fourier-Transform Infrared Spectroscopy Technique, Journal of Science and Technology Research/Nigerian Institution of Professional Engineers and Scientists, Abuja
https://journals.nipes.org/index.php/njstr/article/view/823 Vol.5 Pages: 128-137
- SC Ikpeseni, M Ekpu, CS Odali, SO Sada, HI Owamah, E Atikpo, J Umukoro (2024) Electrochemical and Adsorption Studies of Siam Leaf Extract’s Effect on Mild Steel Corrosion Inhibition in Sulphuric Acid Medium, Journal of Bio-and Tribo-Corrosion/Springer International Publishing
https://link.springer.com/article/10.1007/s40735-024-00845-1 Vol.10 Pages: 1-11
- M Ekpu, SC Ikpeseni (2024) Characterising the Mechanical Properties of a Composite Material Comprising Aluminium and Silicon Carbide, Silicon/Springer Netherlands
https://link.springer.com/article/10.1007/s12633-024-03006-8 Vol. Pages: 1-10
