Email: ekpum@delsu.edu.ng

  • Area of Specialization: Thermal Engineering (Design, Finite Element Modelling, and Materials characterization), and Manufacturing
  • Department of Mechanical Engineering

  • Engr. Dr Mathias Ekpu, MNSE, MNIMechE, COREN Registered, is currently a Senior Lecturer in the Department of Mechanical Engineering and also, the Associate Dean of the Faculty of Engineering, Oleh Campus. He received his first degree in Mechanical Engineering from Ambrose Alli University Ekpoma. While his Master’s degree in Mechanical and Manufacturing Engineering and his Doctor of Philosophy degree in Mechanical Engineering were awarded by University of Greenwich London, United Kingdom. Dr Ekpu is research active and has authored and co-authored several journal and conference articles. His area of research includes: Thermal management (this involves design, finite element modelling, and material characterization) and Manufacturing. Dr Ekpu has served in different capacity within the University, Faculty of Engineering, and Department of Mechanical Engineering. He is the former Head of Department of Mechanical Engineering and he has been involved in several committees either as a member or as chairman.
    My Publications
  1. Ekpu, M (2021) Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics, Soldering & Surface Mount Technology/Emerald Insight
    https://www.emerald.com/insight/content/doi/10.1108/SSMT-07-2020-0033/full/html Vol.ahead-of-print Pages: ahead-of-print

  2. Ekpu, M (2021) Effect of Elevated Temperatures on SAC305 Solder Alloy Thermal Interface Material in a Microelectronic Assembly, FUOYE Journal of Engineering and Technology/Faculty of Engineering FUOYE
    http://engineering.fuoye.edu.ng/journal/index.php/engineer/article/view/590 Vol.6 Pages: 77-81

  3. Ekpu, M (2021) Investigating the Reliability of SnAgCu Solder Alloys at Elevated Temperatures in Microelectronic Applications, Journal of Electronic Materials/Springer Nature
    https://link.springer.com/article/10.1007/s11664-021-08968-8 Vol.In Press Pages:

  4. Ekpu, M (2020) The Effect of Silicon Carbide Particulate Inclusions on Aluminium Metal Matrix Composite Materials, Umudike Journal of Engineering and Technology/Faculty of Engineering and Engineering Technology, Michael Okpara University of Agriculture, Umudike
    https://ujetmouau.net/journal_paper.aspx?PID=226 Vol.6 Pages: 26-34

  5. Ekpu, M (2020) Thermo-Mechanical Analysis of Aluminium Silicon Carbide Composite Materials, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
    https://www.ajol.info/index.php/jasem/article/view/197666 Vol.24 Pages: 961-966

  6. Ekpu, M (2020) Optimisation of a Microelectronic Assembly Package using Response Surface Methodology, Nigerian Journal of Technology (NIJOTECH)/Faculty of Engineering, University of Nigeria, Nsukka
    https://www.nijotech.com/index.php/nijotech/article/view/2443 Vol.39 Pages: 1058-1065

  7. Ekpu, M. and Obadina, O.B. (2020) Power Production using Natural Gas in Nigeria: Trends, Challenges and Way Forward, Nigerian Research Journal of Engineering and Environmental Sciences/Faculty of Engineering UNIBEN
    http://rjees.com/abstract/power-production-using-natural-gas-in-nigeria-trends-challenges-and-way-forward Vol.5 Pages: 873-885

  8. Ekpu, M (2020) Effect of Tensile Load on the Mechanical Properties of AlSiC Composite Materials using ANSYS Design Modeller, Nigerian Journal of Technological Development (NJTD)/Faculty of Engineering and Technology, University of Ilorin, Nigeria
    https://journal.njtd.com.ng/index.php/njtd/article/view/576 Vol.17 Pages: 301-305

  9. Ekpu, M (2019) Finite Element Analysis of the Effect of Fin Geometry on Thermal Performance of Heat Sinks in Microelectronics, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
    https://www.ajol.info/index.php/jasem/article/view/192501 Vol.23 Pages: 2059 - 2063

  10. Ekpu, M (2018) Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices, Journal of Applied Sciences and Environmental Management/Faculty of Science, University of Port Harcourt, Nigeria
    https://www.ajol.info/index.php/jasem/article/view/181395 Vol.22 Pages: 1797 - 1800

  11. M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba (2014) The effect of thermal constriction on heat management in a microelectronic application, Microelectronics Journal/Elsevier
    https://www.sciencedirect.com/science/article/abs/pii/S0026269213002516 Vol.45 Pages: 159 - 166

  12. M Ekpu, R Bhatti, MI Okereke, S Mallik, K Otiaba (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics, Microelectronics Reliability/Elsevier
    https://www.sciencedirect.com/science/article/abs/pii/S002627141300317X Vol.54 Pages: 239 - 244

  13. KC Otiaba, RS Bhatti, NN Ekere, S Mallik, M Ekpu (2013) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach, Engineering Failure Analysis/Elsevier
    https://www.sciencedirect.com/science/article/abs/pii/S1350630712002166 Vol.28 Pages: 192 - 207

  14. M Ekpu, R Bhatti, MI Okereke, S Mallik, KC Otiaba (2013) Prediction and optimization of design parameters of microelectronic heat sinks, Journal of Emerging Trends in Engineering and Applied Sciences/Scholarlink Research Institute
    https://www.scholarlinkinstitute.org/jeteas/abstractview.php?id=0063 Vol.4 Pages: 493 - 500

  15. M Ekpu, R Bhatti, MI Okereke, KC Otiaba (2013) Fatigue life analysis of Sn96. 5Ag3. 0Cu0. 5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications, International Symposium on Microelectronics/imapsource.org
    https://www.imapsource.org/doi/abs/10.4071/isom-2013-WA23 Vol.2013 Pages: 473 - 477

  16. M Ekpu, R Bhatti, N Ekere, S Mallik, K Otiaba (2012) Effects of thermal interface materials (solders) on thermal performance of a microelectronic package, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS/IEEE
    https://ieeexplore.ieee.org/abstract/document/6235300 Vol. Pages: 154 - 159

  17. KC Otiaba, RS Bhatti, NN Ekere, S Mallik, MO Alam, EH Amalu, M Ekpu (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device, Microelectronics Reliability/Elsevier
    https://www.sciencedirect.com/science/article/abs/pii/S0026271412000339 Vol.52 Pages: 1409 - 1419

  18. M Ekpu, R Bhatti, N Ekere, S Mallik, E Amalu, K Otiaba (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package, International Conference on Adaptive Science and Technology/IEEE
    https://ieeexplore.ieee.org/abstract/document/6145164 Vol. Pages: 127-132

  19. M Ekpu, R Bhatti, N Ekere, S Mallik (2011) Advanced thermal management materials for heat sinks used in microelectronics, European Microelectronics & Packaging Conference/IEEE
    https://ieeexplore.ieee.org/abstract/document/6142404 Vol. Pages: 1 - 8

  20. KC Otiaba, RS Bhatti, NN Ekere, S Mallik, EH Amalu, M Ekpu (2011) Thermal effects of die-attach voids location and style on performance of chip level package, International Conference on Adaptive Science and Technology/IEEE
    https://ieeexplore.ieee.org/abstract/document/6145176 Vol. Pages: 231 - 236

  21. KC Otiaba, RS Bhatti, NN Ekere, M Ekpu, J Adeyemi (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device, International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)/IEEE
    https://ieeexplore.ieee.org/abstract/document/6081033 Vol. Pages: 1 - 5